High temperature polyimide [already fully imidized, no further curing/imidization required] soluble in many organic solvents. Tg 326 C, 20 g package
Matrimid 5218 Resin, A Soluble Polymide
Matrimid 5218 is an amorphous polymer with glass transition temperature above 320 deg C and it can be used as high temperature dielectric materials. Unlike Kapton which requires further imidization after forming film, Matrimide 5218 is a fully imidized polymer resin and it can be dissolved in several common organic solvents to directly process into film. No post-curing or imidization is required.
Main Applications: membrane for gas and water separation, dielectric film, high temperature adhesive.
Glass Transition: 320 deg C
Matrimid 5218 is a thermoplastic polyimide based on a proprietary diamine, 5(6)-amino-1-(4' aminophenyl)-1,3,-trimethylindane.
Matrimid® 5218 is a soluble thermoplastic polyimide. It is fully imidized during manufacturing, eliminating the need for high temperature processing. Matrimid 5218 is soluble in a variety of common solvents. Evaporation of the solvents leaves a strong, durable, tough coating.
- Fully imidized
- Does not require high temperatures for processing
- Soluble in a variety of common solvents
- Excellent adhesion
- Durable and tough films
- Excellent chemical resistance
- Very good thermal properties
- 100% solid powder
Matrimid 5218 is a soluble thermoplastic polyimide. There is no polyamic acid precursor in the product that would require a high temperature cure to convert to the imide form. This lack of amic acid groups allows relatively simple processing compared to conventional polyamic acid precursor polyimides. For example, when solutions of Matrimid 5218 are used for coating applications, the substrate need only be heated to a temperature and for a time sufficient to thoroughly remove the solvent. When the solvent has been removed, a strong, durable polymide coating remains. By contrast, the more common polyamic acid precursor polyimides must be heated to high temperatures for long periods to convert the polyimide structure. This "curing" process evolves a water by-product and makes it very difficult to form pinhole-free coatings or void-free parts from those materials. No water is evolved in using Matrimid 5218 because no curing (imidization) occurs during processing.
Matrimid 5218 has very unusual and desirable properties. Its high thermal stability and high glass transition temperature make Matrimid 5218 suitable for adhesive applications as well as matrix resin for composite applications. Figure 1 shows the change in modulus versus temperature of a neat resin molding based on Matrimid 5218 (Dynamic Mechanical Analysis). Table 1 illustrates the adhesive properties of Matrimid 5218 with a variety of substrates.
Matrimid 5218 is soluble in many organic solvents and possesses excellent chemical resistance to water, steam, brine, acids, caustic and non-polar organic solvents, unlike other polyimides. As a soluble thermoplastic, Matrimid 5218 retains its solubility in certain polar organic solvents after processing, unless it has been thermally or chemically crosslinked before exposure to these solvents.
Inherent viscosity, dl/g 0.62-0.68 (10.5 in NMP at 25°C)
Volatile content, % <0.7 (22 gm sample heated to 260°C for 45 minutes)
Methylene chloride, Ethylene chloride, Chloroform, Tetrachloroethane, Tetrahydrofurane (THF), Dioxane, Acetophenone, Cyclohexanone, m-Cresol, g-Butyrolactone, Dimethylformamide (DMF), Dimethylacetamide (DMAC), N-methylpyrrolidone (NMP)